We are seeking an experienced Principal Electronic Design Engineer to lead the design and development of high-speed multilayer PCB boards for advanced electronic products. This role will be responsible for end-to-end PCB design activities across the full product lifecycle, from new product introduction (NPI) through to sustaining engineering, with a strong focus on FPGA-based high-speed board design.
Key Responsibilities
- Lead the design and development of high-speed multilayer PCB boards for complex electronic systems.
- Manage PCB design activities from concept, schematic capture, layout, prototyping, validation, NPI, and sustaining support.
- Design main boards with more than 10 PCB layers, ensuring performance, manufacturability, and reliability.
- Develop board designs supporting high-speed FPGA interfaces, ensuring compliance with signal integrity and timing requirements.
- Integrate and optimize high-speed interfaces such as:
- USB 3.0
- HDMI 2.0
- PCIe Gen 4 and above
- 12G SDI
- Collaborate closely with hardware, FPGA, signal integrity, and manufacturing teams to ensure robust board design and successful product deployment.
- Perform or support signal integrity analysis, including eye pattern simulation, impedance control, and high-speed signal validation.
- Drive PCB layout best practices for high-speed digital design, including stack-up definition, controlled impedance routing, EMI/EMC considerations, and thermal management.
- Work with PCB CAD tools such as Cadence, PADS, Altium, or equivalent to develop complex board layouts.
- Support board bring-up, debugging, and design improvements during prototyping and production phases.
- Ensure design documentation is complete and aligned with engineering and manufacturing standards.
Requirements
- Bachelor's degree in Electrical Engineering, Electronics Engineering, or related discipline.
- Minimum 10 years of PCB design experience, with full lifecycle exposure from NPI to sustaining.
- Proven experience designing high-speed FPGA-based PCBs.
- Strong hands-on experience designing multilayer boards with more than 10 layers (mandatory).
- Strong knowledge of high-speed interfaces such as:
- USB 3.0
- HDMI 2.0
- PCIe Gen 4+
- 12G SDI
- Experience with signal integrity analysis, including simulation and eye diagram validation, is highly preferred.
- Proficiency with Cadence, PADS, Altium, or similar PCB design platforms.
- Experience designing boards for industries such as:
- Networking
- Datacenter hardware
- Video processing
- Imaging systems
- Experience with Xilinx FPGA platforms is highly preferred.
- Strong understanding of PCB stack-up design, impedance control, routing constraints, and manufacturing processes.
- Good problem-solving skills with experience in board bring-up and hardware debugging.
- Strong communication skills and ability to work in cross-functional engineering teams.
Preferred Qualifications
- Experience in signal integrity simulation tools.
- Prior work on high-speed networking or video processing hardware platforms.
- Familiarity with design for manufacturability (DFM) and design for testability (DFT) practices.
