Job description
Role Overview
Lead and drive the 12 wafer bumping engineering team, overseeing process development, optimization, and qualification. Provide strategic direction, ensure high yield and quality, and align technology roadmap with industry trends.
Key Responsibilities
Provide leadership and strategy for bumping engineering team
Develop, optimize, and qualify 12 bumping processes
Define and execute technology roadmap for bumping
Collaborate with manufacturing, quality, equipment, and R&D teams
Manage resources, including team, equipment, and budget
Drive innovation, continuous improvement, and risk mitigation
Ideal Requirements
Bachelor's/Master's in Engineering, Physics, Materials Science, or related field
10-12 years experience in bumping engineering or related field with strong 12 wafer expertise
Proven leadership with team management and strategic initiative success
Strong technical knowledge in bumping process development, integration, and optimization
Excellent communication and cross-functional collaboration skills
Strong analytical and problem-solving abilities
If you would like to be considered for this opportunity, please forward a copy of your full CV to [Confidential Information]
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614
