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Responsibilities
. Lead NPI team in design reviews, feasibility builds, characterization, and qualification
. Support customer builds and liaise with customers, TPMs, and PTMs
. Drive technology transfer from R&D to Operations
. Lead process optimization and improvements in eWLB technology
. Perform risk assessments, FMEA, and DOE for new products
. Coordinate cross-functional teams for new product startup and ensure smooth, excursion-free ramp
. Resolve issues from engineering builds and oversee documentation (eNPI/qualification reports)
. Support customer engagements and fab visits
. Set and track KPIs to ensure timely delivery and successful qualification
. Train team in statistical process characterization methods
Requirements
. Degree (B.Eng/B.Sc/M.Eng/M.Sc/PhD) in Engineering, Physics, Materials Science, or equivalent
. 5 years in Wafer Fab or Wafer Bump
. 3 years in a management role
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to [Confidential Information] stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
www.peopleprofilers.com
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID: 5WY53653
Job ID: 145220083