Research Engineer (Heterogeneous Integration), IME

Job Title: Heterogenous Integration Research Engineer

About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics. At IME, youll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.

Position Overview: We are seeking a highly motivated Research Engineer to drive the development of advanced packaging processes. This role offers the opportunity to work on innovative technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Key Responsibilities:

• Innovative Process Development: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
• Evaluation and Characterization: Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
• Project Collaboration: Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
• Intellectual Property and Reporting: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
• Customer and Market Engagement: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

Requirements:

• Educational Background: Master's degree or bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience: Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is added advantage.