Job Description

Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging.
Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.

Key Job Accountabilities (Actual daily deliverables):

Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies.
Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP.
Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment.
Drive process validation, yield stabilization, troubleshooting, and root-cause analysis.
Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness.
Provide technical support for customer programs, including feasibility evaluation and issue resolution.
Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness.
Support advanced packaging separation process development andqualification.
Improve yield, quality, process capability, and manufacturing robustness.
Drive process innovation aligned with customer programs and technologyroadmaps.
Support customer technical requirements and timely resolution of processissues.
Conduct process characterization, data analysis, and technical risk assessment to establish robust and scalable processes.
Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage.

Requirements

Bachelor's degree in Engineering(Mechanical/Materials/Electronics)
3-5years of hands-on experience in process engineering in semiconductor manufacturing.
Fundamental understanding of advanced semiconductor fabrication and integration processes.
Proficiency in preparing technical documentation and delivering presentations

JOB ID: JOB-JK30102026

All Successful candidates can expect avery competitive remuneration package and a comprehensive range of benefits.

Kindly email your resume in adetailed Word format to [Confidential Information]

1. Current and Expected Salary

2. Date of availability

3. Reason for leaving each job:

We regret that only shortlisted candidates will be notified

People Profilers Pte Ltd