R&D Process Development Engineer (Flip Chip/ TCB)

Responsibilities:

• Strong expertise in root cause analysis and problem-solving methodologies
• Drive process and machine improvement, including the implementation of specific process enhancement
• Support and manage customer engineering build activities
• Plan, execute and document DOE activities, including report submission & presentation
• Conduct failure analysis and root cause investigation, report preparation & presentation
• Work with third party and identify solutions to enhance capabilities
• Coordinate all customer engineering and qualification builds with cross-functional factory teams to optimise resource utilisation
• Monitor & track the progress of key deliverables to achieve defined Key Milestone and Success Criteria including regular communication with customers
• Set & monitor the KPI for the team base on underfill development projects

Requirements:

• Bachelor's degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline
• Experience in high volume electronics manufacturing environment preferably semiconductor or module assembly
• Must be familiar and have hands-on experience with Flip Chip/ TCB process and machines
• Familiar with JMP data analysis capability
• Knowledge and experience on multiple process of the above will be an advantage
• Proven experience in assembly FOL/ EOL process (at least 5 years experience)