R&D Manager

. Being the technical project leader (with cross functional team), overseeing new product development with respect to UTAC roadmap per required schedule and budget. Ensure smooth execution of project till pre-production stage.

. Must be familiar and have working knowledge of semiconductor packaging including design, mechanical, thermal and electrical requirements.

. Knowledgeable with semiconductor processes including Wafer prep, Flip Chip, Die Attach, Wirebond, Underfill / Dispensing, Molding, Laser marking, Heatsink/ Lid attach, Ball mount, singulation, and SMT process.

. Familiar with Failure analysis techniques and root cause analysis.

. Enable technology offload to assembly and ensure UTAC system requirements (APQP) and customers needs are met

. Provide technical advice and consultation to secure business & strengthen competitiveness. Contribute actively in promoting UTAC technological capability through customers presentation

. Set, align and drive goals and strategies of department. Identify and propose new package and process development for UTAC roadmap

. Manage resources efficiently to fulfill project/ program requirements as well as overall group performance and synergy. Provide coaching and non-technical assistance to remove barriers/ obstacles so as to achieve department goals.