Product Specialist - Flip Chip/Wire Bond

Process-Oriented Product Specialist who understands semiconductor packaging and bonding processes

Key skills:

. Thermal Compression Bonding (TCB)

. Die Attach / Die Bonding

. Wire Bonding

. Flip Chip

. Advanced Packaging (SiP, WLCSP, BGA, QFN)

. Semiconductor Process Engineering

The role involves providing technical support to customers, troubleshooting process-related issues, collaborating with engineering teams, and supporting semiconductor assembly and packaging solutions across region.