Job Description

Job Description & Requirements

As part of the Process Engineering group, this position involves contributing to the development of Front/Back End processes for thermal management product.

The role also involves establishing and optimizing related process parameters related to process cleaning, laser marking, dicing, mask design, plating/sputtering thin films.

Also work closely with internal cross-functional teams, external vendors and technology partners on application development from concept prototype phase to production introduction.

Roles & Responsibilities

. Support processes to deposit conductive (metal) films by Plating, PVD Sputtering and Vacuum Evaporation.

. Support film characterization techniques for metrology and inspection

. Perform day-to-day operations of deposition tools - tool and process monitoring, post PM process qualification, troubleshooting

. Work closely with integration and test teams on developing critical to quality (CTQ) metrics, root cause analysis (RCA) and corrective actions for yield improvements

. Work closely with equipment engineers and external suppliers on tool improvements and selection of new equipment

Requirements

. ITE Polytechnic in Materials/Production Engineering or related field

. Min. 3 years of experience leading manufacturing processes in at least one of the following fields: semiconductor front or back end such as wafer bumping, dicing, mask design, plating and thin film process development.

. Knowledge of UHV vacuum manufacturing equipment and associated sensors and components (Pumps, valves, pressure sensors, spectrometers, MFC's, pressure controllers, pyrometers, etc.)

. Hands on fabrication: mechanical assembly, mechanical design and manufacturing and mask design.

. Experience working around delicate high-tech equipment.

. Experience in statistical analysis methods and tools, design of experiment

. Understanding of materials characterization and FA techniques

. Good communication and teamwork skills.