Job Description

The Process Integration team is focusedon the incorporation of all processes in manufacturing for high yield and bestquality/CT eWLB products. This position reports to Director, ProcessEngineering and oversees Process Engineer and Process Associate Engineer roles.

Responsibilities

. Work closely with AOI/process/equipment engineering team to swiftly contain high Defect Density and inline excursions and find root causes and provide working solutions to satisfy customer quality

. Review unresolved requests for adjustment of complaints and read customer comments to determine basis of complaint and plan of action needed to resolve complaint

. Drive process improvement plan based on systematic analysis of inline/Electrical Test/yield data to meet quality and yield targets

. Identify key process weaknesses and perform fine tuning on existing processes for continuous improvement to yield/quality/productivity and cost

. Use statistical knowledge (e.g. DOE, SPC) and systematic problem-solving techniques(e.g. 8D, 5 Whys) to determine root causes for low yield wafers/lots as well as developing containment/corrective/preventive action plans

. Lead process control plan update and customer audit

. Supportnew Process/Product qualification from product design through to LVM completion

Requirement

. Degree in Physics, Chemistry, Material Science, Mechanical/Chemical/Electrical Engineering or equivalent

. 5to 10 years of relevant experience in wafer bumping, wafer fabrication or packaging

. Strong knowledge in process integration scheme/ process stability and yield enhancement activities

JobID: JOB-01220

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

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