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Process Engineering Trainee (Wet Process) - GRIT Traineeship

Process Engineering Trainee (Wet Process) - GRIT Traineeship

visionpower semiconductor manufacturing company pte. ltd.
  • Posted 19 hours ago
  • Be among the first 10 applicants

Job Description

The trainee will undergo a structured 6-month on-the-job training programme within the Wet Process Engineering team in a 300mm semiconductor wafer fabrication facility. Designed for fresh Polytechnic graduates, the programme provides foundational exposure to semiconductor manufacturing, wet cleaning and wet etching processes, statistical process control (SPC), manufacturing data analysis, and process improvement methodologies. Under the guidance of experienced engineers, the trainee will develop technical competencies required for an Associate Engineer role while supporting daily manufacturing operations and continuous improvement initiatives.

1. Learn semiconductor manufacturing fundamentals and the role of Wet Process technologies in wafer fabrication.

2. Support monitoring of daily Wet Process operations, process performance, and key manufacturing indicators.

3. Assist in process data collection, SPC chart monitoring, and process performance reporting.

4. Participate in process troubleshooting and investigation of process deviations under engineer supervision.

5. Support process optimization and continuous improvement projects to improve yield, quality, productivity, and process stability.

5. Collaborate with Manufacturing, Equipment Engineering, Quality, and Process Engineering teams to understand fab operations.

6. Complete a structured process improvement project and present outcomes and recommendations upon completion of the traineeship.

Requirement
- Fundamentals of semiconductor wafer fabrication.

- Understanding of Wet Process technologies, including wafer cleaning, chemical treatment, and wet etching processes.

- Statistical Process Control (SPC) and process monitoring techniques.

- Manufacturing data collection and analysis.

- Basic problem-solving and root cause analysis methodologies.

- Process improvement and continuous improvement concepts.

- Technical report writing and presentation skills.

- Cross-functional collaboration and communication skills.

- D12Safety, environmental, and quality compliance within a semiconductor manufacturing environment.

More Info

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Key Skills

Semiconductor wafer fabrication

Process improvement methodologies

Wet Process technologies

Cross-functional collaboration

Manufacturing data collection and analysis

Problem-solving and root cause analysis