Provide strategic direction and leadership for the 12 bumping engineering team, aligning with company goals and objectives
Oversee the development, optimization, and qualification of 12 bumping processes, ensuring high yield, quality, and reliability
Develop and execute a technology roadmap for 12 bumping, staying ahead of industry trends and requirements
Collaborate with cross-functional teams, including manufacturing, quality, equipment engineering and RnD, to ensure seamless integration of bumping processes
Manage resources, including personnel, equipment, and budget, to achieve departmental goals and objectives
Foster a culture of innovation and continuous improvement, identifying opportunities for process enhancements and implementing changes
Identify and mitigate risks associated with bumping processes, ensuring minimal impact on production and quality
Requirements:
Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related field
Minimum 10-12 years of experience in bumping engineering or a related field, with experience in 12 wafer processing
Strong technical expertise in bumping processes, including process development, integration, and optimization
Proven leadership experience, with a track record of managing teams and driving strategic initiatives
Excellent communication and collaboration skills, with ability to work with cross-functional teams
Strong analytical and problem-solving skills, with ability to identify and resolve complex technical issues
