Responsibilities
- Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
- Ensure wire bonding process meets customer's specifications and requirements
- Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
- Co-ordinate NPI and NPQ activities to meet given timeline
- Qualify new product, material, device, and machinery
- Participate in new tape development, and new material development activities
- Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
- Benchmark new materials and new equipment technology in the market
- Train co-workers on new process implementation and new machinery operations
- Maintain, troubleshoot, and perform minor repair of assembly and test machinery
- Develop new and update existing Standard Operating Procedures
- Participate in internal audits, customers audits and external audits
- Comply with all quality, environmental, health, safety, and security policies and procedures of the Company
Requirements
- Degree or Diploma in Material Science / Electronics Engineering
- Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT)
- Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires
- Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.
- Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing
- Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives
- Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
- Good in problem solving, excellent interpersonal and communication skill
GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960
