ocap, CQM, Fmea, Spc, IC assembly processes, ESEC ASM KNS wire bonders, Material science of bonding wires, Die attach, Copper wire bonding, Doe, Wire bond encapsulation, JEDEC, QEMS

Testing, encapsulation, ocap, wire bonding, Fmea, Spc, IC assembly processes, Equipment Maintenance, Iso 9001, die attach, Doe, JEDEC, KNS wire bonders