SUMMARY
We are seeking a highly skilled and detail-oriented Process Engineer to develop, optimize, and maintain surface mount assembly processes for printed circuit board assemblies (PCBA). The ideal candidate will ensure high-yield, low-defect production by improving process capability, equipment utilization, and quality assurance.
ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned.
- Develop and maintain SMT assembly processes (screen printing, pick-and-place, reflow soldering, Wave, SPI).
- Analyze and improve process capability (Cp, Cpk), first pass yield (FPY), and overall equipment effectiveness (OEE).
- Define, monitor, and optimize reflow oven thermal profiles for lead and lead-free soldering.
- Drive root cause analysis and corrective actions for process defects (e.g., tombstoning, solder bridging, head-in-pillow).
- Support New Product Introductions (NPI) by establishing process flows, documentation, and line setup.
- Perform DFM/DFT reviews with design and test engineering teams.
- Create and update standard operating procedures (SOPs), work instructions, and training materials.
- Lead process validation, DOE (Design of Experiments), and statistical process control (SPC).
- Work closely with cross-functional teams including quality, production, R&D, and equipment engineering.
- Ensure compliance with IPC-A-610, J-STD-001, ESD, and other industry standards.
MINIMUM REQUIREMENTS
- Bachelor's degree in Electronics, Mechanical, Mechatronics, or Industrial Engineering (or related field).
- 4-6+ years experience in SMT or PCBA manufacturing environment.
- Strong knowledge of SMT machines.
- Well verse on ISO 134854- Medical requirements. (Will be advantage)
