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Job ID: 152400717
Skills:
Ms Excel, Python, Dmaic, machine processes, process control strategies, Lean, Minitab, Six Sigma, 8D, Root Cause Analysis, Jmp
Skills:
QEMS, Die attach, ocap, Copper wire bonding, JEDEC, Fmea, Spc, Wire bond encapsulation, CQM, ESEC ASM KNS wire bonders, IC assembly processes, Doe, Material science of bonding wires
Skills:
Solidworks, Microsoft Office, Excel, Python, PCB Assembly, Data Analysis, SMT line, Jmp
Skills:
adhesive epoxy or other bonding material, active alignment process optics bonding equipment, quantitative measurement methodology, optics alignment process, design of experiment, camera module process development, Root Cause Analysis, engineering statistic, metrology tools, camera active alignment process development, image and optical test
Skills:
3d packaging , packaging process flow, process integration, MCM, FCBGA, thermal stress simulation, process design rules, corrective action implementation, FCCSP, Root Cause Analysis