Ms Excel, Python, Dmaic, machine processes, process control strategies, Lean, Minitab, Six Sigma, 8D, Root Cause Analysis, Jmp

QEMS, Die attach, ocap, Copper wire bonding, JEDEC, Fmea, Spc, Wire bond encapsulation, CQM, ESEC ASM KNS wire bonders, IC assembly processes, Doe, Material science of bonding wires

Solidworks, Microsoft Office, Excel, Python, PCB Assembly, Data Analysis, SMT line, Jmp

adhesive epoxy or other bonding material, active alignment process optics bonding equipment, quantitative measurement methodology, optics alignment process, design of experiment, camera module process development, Root Cause Analysis, engineering statistic, metrology tools, camera active alignment process development, image and optical test

3d packaging , packaging process flow, process integration, MCM, FCBGA, thermal stress simulation, process design rules, corrective action implementation, FCCSP, Root Cause Analysis

Technology characterization, Deposition process equipment, process integration

Microsoft Office, Excel, Python, Sql, Jmp

Nickel Ni plating, Fmea, Spc, wet and dry manufacturing processes, Copper Cu plating, 8D, Capa, Chemical Analysis

5-Why, Minitab, Fishbone, 8D, Jmp