Job Description

Responsibilities

Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies implement corrective actions to enhance tool stability and reliability.
Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
Develop test procedures, application recipes, and documentation for process qualification and validation maintain detailed logs and technical reports.
Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Job Requirement

Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, or related field).
3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
Experience with semiconductor equipment integration, motion control systems, and process development.
Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
Willingness to travel for customer support and on-site installations (as required).

Lester Ong Yu Xuan | Reg No : R26162868

The Supreme HR Advisory Pte Ltd | EA No. : 14C7279