Principal Process Development Engineer -Advanced Photonics Packaging

• Research and Development - Advanced Photonics Packaging
• 10 years of experience needed ( Min )

Looking for highly skilled and expere3nced engineering talents to be part of the R & D team in Singapore for the advanced photonics packaging design and process development.

You should have a deep understanding of photonics and semiconductor technologies, extensive hands-on experience in developing and implementing advanced packaging solutions.

Responsibilities

Lead and design, develop, optimized of advanced photonics packaging solutions and processes for fiber optic interconnect products, including pluggable optical transceivers.

Define test strategy, DFM matrix and requirements of new products and process development, manage prototypes and work with manufacturing teams to scale processes for high volume production.

Qualifications

Bachelor or above in Electrical Engineering, Mechanical Engineering , Physics, Material Scienceor related field

Minimum 10 years of experience in advanced packaging design and process development

Extensive knowledge of optical communication, high speed transcievers, MEMS , 2.5D/3D silicon photonics packaging and processes.