Principal Engineer (CMP Module)

Intro to GF

GlobalFoundries (GF) is one of the world's leading semiconductor foundries and the only one with a truly global footprint spanning three continents. We manufacture complex, feature-rich integrated circuits that enable billions of electronic devices. At GF, we make things that matter - from the solutions that enable the way we live today, to the technologies that drive what's possible for tomorrow. Join us in changing the industry that is changing the world. For more information, visit .

Why GF

Be a part of our global team that is at the forefront of providing cutting-edge global technology solutions. We are seeking candidates with a strong passion for new technologies and advanced manufacturing, as we continue our Industry 4.0 Digitalization journey using technologies such as Artificial Intelligence and Machine Learning, robotics, big data analytics and more.

About the Role

As a Principal Engineer focusing on Chemical Mechanical Planarization (CMP), you will be a key technical leader in the Process Module team. You will be responsible for developing, optimizing, and sustaining cutting-edge CMP processes critical to our semiconductor fabrication technology nodes. This role requires deep, hands-on CMP technical expertise, a strategic mindset to drive advanced planarization solutions, and excellent communication skills to collaborate with cross-functional integration teams and external partners.

What you will do:

Technical Expertise & CMP Process Development:

• Develop and modify CMP process formulations, methods, and tool controls to meet stringent quality standards.

• Analyze, and review technical data and charts to ensure CMP performance, focusing on non-uniformity, defectivity, and removal rate stability.

• Establish and maintain Standard Operating Procedures (SOPs) and Failure Mode and Effects Analysis (FMEA) specific to the CMP module.

• Integrate CMP equipment capabilities and material systems to meet process module and technology specifications.

• Lead recipe creation, maintenance, and optimization for CMP metrology tools (e.g., film thickness measurement, surface inspection) to ensure accurate process monitoring and improve recipe quality.

Leadership & Collaboration:

• Drive Continuous Improvement Plans (CIPs) to enhance process performance and productivity.

• Lead and participate in cross-functional teams to achieve organizational goals.

• Serve as a technical subject matter expert for CMP, providing guidance and training to junior CMP engineers.

• Collaborate with vendors and other internal teams for benchmarking and cross-learning initiatives.

• Demonstrate mastery in all aspects of the CMP technical discipline, with group-wide recognition as a senior member of a technical team.

Problem-Solving & Innovation:

• Solve complex, novel, and non-recurring technical problems.

• Proactively identify and implement significant changes to existing processes and methods.

• Contribute to intellectual property by being a contributing inventor on patents related to CMP technology.

• Participate in and contribute to conference or journal publications.

Safety & Compliance:

• Perform all activities in a safe and responsible manner.

• Support all Environmental, Health, Safety & Security requirements.

What you need:

• Master's or Bachelor's Degree in Electrical / Electronics / Mechanical / Chemical / Materials Science Engineering ore related field.

• 5 to 8 years of relevant experience in wafer fabrication industry, with a strong focus on CMP.

• Good interpersonal and communication skills

• Good analytical and project management skills

• Organized and systematic in problem solving, familiar with SPC, DOE & FMEA