PMTS ULP CMOS Advanced Packaging Program Manager

• You will be the responsible Program Manager for Technology Development Programs within GlobalFoundries new advanced packaging facility in Singapore.
• Plan and manage the execution for complex semiconductor engineering development programs.
• Own the overall program schedule, resource allocation and alignment of program Milestone deliverables.
• Collaborate with the overall integrator to setup routes, build committed schedule, and run hardware to achieve figures of merit
• Ensure seamless transition from development phase into production.
• Lead a cross-functional team of experts throughout the entire Technology Development Program defining tasks & work packages for in-time & in-quality program completion.
• Work closely with Product Marketing, PMO, PDK, Modeling and IP Teams.
• Communicate effectively internally as well as with customers within technical and executive forums.
• May require creation of presentations to provide occasional management or external customer updates.
• Work and collaborate other projects and/or assignments as needed

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
• Travel <10% to other GlobalFoundries facilities may be necessary

Required Qualifications:

• Solid working knowledge of modern CMOS process integration.
• Being team player with good oral and written communication skills in English are required.
• Strong analytical, problem solving and project management skills.
• You must have several years of experience in technical leadership roles within the semiconductor industry.
• Track record in Technology Development and/or program management of complex, cross-functional engineering programs.
• Fluent in English Language written & verbal
• Exposure to semiconductor volume manufacturing methods, statistical methods, FMEA/8D Methodology, external customer & multicultural working environment is beneficial.
• Masters/ Diploma degree in Engineering or Science (e.g. Physics, Chemistry, Materials) and/ or PhD or a related field from an accredited university.
• Additional professional experience in advanced module development, integration and/or advanced packaging:
• B.S. + minimum of 15+ years of relevant experience
• M.S. + minimum of 10 of relevant experience
• Ph.D. + minimum of 8 of relevant experience
• Skills: Familiarity with integration skills including lot handling, DOE, inline/HOL/ET analysis and monitoring. Strong communication and coordination skills cross the department and cross-organizationally. Strong team collaborator across multiple geographical locations & proactive mindset.
• Fluency in English Language written & verbal