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GlobalFoundries

PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)

Early Applicant
  • Posted a month ago
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1-3 Years

Electronic Components/Semiconductors

Job Description

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit .

Summary of Role:

GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI)R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.

Essential Responsibilities:

  • Lead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in the product lines (e.g., multi-die stacking, fine pitch hybrid bonding, etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs.

  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.

  • Develop expertise in the processes, materials and toolingleveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.

  • Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes.

  • Drive understanding of failure modes.

  • Facilitate advanced packaging interactions between the GF Singapore Product Line/Fab teams and customers.

  • Generate IP related to novel wafer integration & packaging technology.

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

  • Take part in hiring of other Advanced Packaging team members in Singapore.

  • Mentor and guide new hires to assume their roles and responsibilities.

  • Other duties as assigned by manager.

Required Qualifications:

  • Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.

  • MS degree with at least 12 years of prior related work experience.

  • Must have at least an overall 3.0 GPA and proven good academic standing.

  • Language Fluency - English (Written & Verbal).

  • Travel - Up to 20%.

Preferred Qualifications:

  • Education - PhD education level preferred with at least 10 years of prior related work experience.

  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.

  • Project management skills, i.e. the ability to innovate and execute on solutions that matter the ability to navigate ambiguity.

  • Strong written and verbal communication skills.

  • Strong planning & organizational skills.

Information about our benefits you can find here:

Date Posted: 27/08/2025

Job ID: 124765129

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About Company

GlobalFoundries Inc. is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York.

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Last Updated: 01-10-2025 06:41:24 AM
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