NTI Physical Failure Analysis Technician

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Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Micron NAND Technology Integration (NTI) Singapore is seeking a Yield Enhancement Physical Failure Analysis Technician to be responsible for providing physical failure analysis for next-generation Micron products. In this meaningful role identification and communication of failure mechanism and assisting with the root cause analysis for yield issues. You will need to be knowledgeable and have hands on experience with physical analysis tools such as but not limit to acid hood operation, polish wheel, delayer techniques with wet/dry etch, SEM, dual beam FIB, and STEM lamella creation. You will also help support the transfer of physical failure analysis processes into production.

Qualifications:

• Self-motivated and enthusiastic to find creative solutions to the challenges
• Passionate about learning semiconductor memory and fabrication.
• Drive to succeed and ability to energize the team
• Highly motivated with good analytical and problem-solving skills
• Excellent written, communication and presentation skills
• Excellent technical social skills
• Delayering failing devices using a variety of wet and dry techniques
• Focused Ion Beam and STEM/TEM usage for cross section analysis and SEM operation for top-down analysis
• Generate slice and view images for inline process improvement feedback
• Recognize, identify, and raise awareness of new failure mechanisms with the motivation of who needs to know this now!
• Possess a continuous improvement process (CIP) mindset where you are always looking for ways to improve the operations of the area
• Demonstrate understanding of physical failure analysis on semiconductor devices

The Yield Enhancement group is a multi-disciplinary group, drawing engineers from Chemical, Materials, Electrical, Statistics and device physics. TD YE-PFA team collaborates with a diverse and talented team to isolate the root causes of the fails, and enable processes integration to deliver the next generation of memory processes nodes to production fab (manufacturing). PFA engineers require knowledge of semiconductor device physics, fabrication, operation, architecture, and statistics. PFA group routinely uses bench testers, emission and laser techniques for fail isolation. In addition work with FIBs, SEMs and TEMs to understand the root cause of the failure.

Responsibilities:

• Collaborate with EFA engineering for a quick identification of a visual defect for a yield issue
• Innovate creative ways improve work efficiency and shorten the time it takes to visualize root cause failures
• Interpret and summarize the data, and present it to corresponding engineers verbal as well as written.
• Build and improve new techniques and find exceptional ways to use the existing tools in order to identify new failure mechanism
• Testing of new processes by evaluating techniques to improve productivity
• Ownership of PFA tools to maintain maximum up time

Education:

ITE or Diploma in an electronics related field or equivalent experience