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Join Micron, where your knowledge will influence the future of memory technology! As the Manager for NAND Design Rule/Process Integration, you will lead a talented team to support both development and large-scale production of advanced 3D NAND technologies. This position is essential for producing accurate design-rule and PDK results, ensuring high quality, and maintaining strict documentation across R&D and production efforts.
Lead the release of design rules and PDK deliverables coordinate DRC waivers, mask definitions, and mask reviews for both R&D and production developments.
Own program execution and achievements from kickoff through end-of-life.
Partner with collaborators across Array & CMOS Process Integration, Devices, Layout & Build, Modeling, Scribe & Frame, unit process areas (e.g., PHOTO/OPC/CMP), and Quality & Reliability to guide new 3D NAND generations.
Ensure high quality and documentation for Build Rule Checks (DRCs) and drive timely disposition of deviations and exceptions.
Collaborate with Yield Improvement, Product Engineering, Defect Analysis, and Quality Assurance to identify layout- or database-related process issues and prioritize corrective actions.
Build and evaluate test structures to generate data for next-generation devices and to assess process margin on current technologies.
Synthesize complex technical problems and communicate status, risks, and resolutions clearly across functions and management levels.
Define and track sub-milestones within PDK/DBR/TO schedules ensure targets are met through cross-team coordination.
Maintain strong, proactive communication with key collaborators and bring up issues early with data-driven options.
Drive continuous improvement in design-rule pathfinding and document takeaways that improve production parts still under development.
PhD in Electrical Engineering, Microelectronics, Physics, or Semiconductor Materials Science with 5+ years of relevant experience or Master's degree with 8+ years or bachelor's degree with 13+ years in the semiconductor industry (Process Integration, Yield Improvement, Product Engineering, Test Structure Development, or Unit Process Development).
Direct experience working with PDK, design rules, and layout, including small layout assignments, is necessary. You must be skilled in CAD software such as Cadence Virtuoso, K2View, and Mentor Graphics DRC/RVE or their equivalents.
A solid understanding of semiconductor device physics and VLSI silicon processing and integration flow is essential.
Demonstrated ability to resolve complex issues and communicate clearly under pressure.
Understanding of 3D NAND process flow and major NAND components (e.g., bit-line sensing, word-line driver, data path, and analog circuits).
Familiarity with CAD group interactions, data post-processing, and data transfer from built databases to reticles.
Preferred: prior leadership experience in R&D for NAND or other memory technologies.
Micron Technology is transforming how information is used globally by advancing memory and storage solutions. The company emphasizes innovation, collaboration, integrity, and professionalism, and is committed to supporting its global community while conducting business responsibly. Join us and be part of a world-class team that competes at the highest levels and successfully implements groundbreaking solutions!
Job ID: 145234271