MTS, FECOS CPIE DEVICE

Principal Device Integration Engineer in Micron's Central Manufacturing Team responsible for enabling technology ramp in production and product yield & quality improvement by working collaboratively with Micron global network on CMOS and Memory device performance enhancement, variability reduction, design and test optimization, process simplification and working methodology improvement.

Job Responsibilities

. Enable technology ramp in high-volume production for CMOS and memory devices.

. Improve device performance with a focus on variability reduction and robustness.

. Support and execute design and test optimisation to enhance manufacturability and performance.

. Identify and implement process simplification and working methodology improvements.

. Lead or actively contribute to cross-functional problem-solving for device, yield, and quality issues.

Job Requirements

. Minimum 5 years of relevant working experience is required. A master's or . Ph.D. degree in Physics or Engineering areas is preferred.

. Working experience in wafer fab process or process integration engineering. . Direct experience in advanced CMOS device technology such as FinFET or GAA is preferable.

. Proven knowledge in semiconductor physics and understanding of transistor operations, scaling limitations and reliability, basic knowledge of CMOS circuits and characterisation methods.

. Understanding of wafer fabrication process areas, including tool sets, process mechanisms, tuning knobs, etc.

. Excellent data analysis skills using software (JMP, SPOTFIRE, etc).

. Strong task ownership, self-motivated to work with other team members to make progress collaboratively.

. Open-minded attitude to learn new skills and could adapt to a new working environment swiftly.

. Good digital literacy with MS Office. Programming capability such as Python is a plus.

.Occasional international business travel is required for this position.