MTS - Advanced packaging Integrator

Summary of Role:

The ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team in our Singapore facility. Applicants for this position would be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process demonstration through manufacturing transfer. Areas of focus could bonding, TSV, DT Capacitor for advanced packaging support of the full ULP CMOS suite of products.

Essential Responsibilities:

• Responsible for leading complex development integration initiatives to meet customer and technology requirements to further GF advanced packaging strategy.

• Leading creation of process flows and process recipes to enable meeting the product requirements for performance, reliability and defect free manufacturing.

• Ensure methods and processes in place to test the devices and structures being developed

• Develops and implements methods and procedures for process control and inspection to ensure that the products are free of flaws and function as designed

• Identify issues and technical challenges, formulate appropriate experiments to understand root cause and improve processes to meet requirements.

• Analyze various data, physical, electrical or defect reports to determine trends and recommend corrective actions

• Lead and execute develop continual improvement through the product development process through to eventual manufacturing transfer including freeze developed processes in preparation for manufacturing and meet all product requirements.

• May require creation of presentations to provide occasional management or external customer updates.

• Work and collaborate other projects and/or assignments as needed

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

• Travel 10% to other GlobalFoundries facilities may be necessary

Required Qualifications:

• Education - BS and above. Electrical Engineering or related field.

• Bachelor of Science (B.S.) or equivalent degree in Electrical Engineering, Material Science or a related field from an accredited university.

• Additional professional experience in advanced module development, integration and/or advanced packaging:

• B.S. + minimum of 5 years of relevant experience

• M.S. + minimum of 4 of relevant experience

• Ph.D. + minimum of 2 of relevant experience

• Skills: Familiarity with integration skills including lot handling, DOE, inline/HOL/ET analysis and monitoring. Strong communication and coordination skills cross the department and cross-organizationally. Strong team collaborator across multiple geographical locations & proactive mindset.

• Fluency in English Language - written & verbal

Preferred Qualifications:

• Project management skills - i.e., the ability to innovate and execute solutions that matter the ability to navigate ambiguity and communicate and track projects through to completion.
• Strong written and verbal communication skills.
• Strong planning & organizational skills