Technical project leader with cross functional team
Oversee new product development per required schedule and budget.
Ensure smooth project execution till pre-production stage.
Work closely and independently with internal/external customers and suppliers to evaluate new enabling process, materials and equipment through regular progress and status update.
Enable technology offload to assembly and ensure system requirements and customers needs are met.
Provide technical advice and consultation to secure business & strengthen competitiveness. Contribute actively in promoting the company's technological capability through customers presentation.
Set, align and drive goals and strategies of department. Identify and propose new package and process development for the Company's roadmap.
Manage resources efficiently to fulfil project/ program requirements as well as overall group performance and synergy. Provide coaching and non-technical assistance to remove barriers/ obstacles to achieve department goals.
Requirements:
Minimum a Bachelor's degree in Electronics, Mechatronics, Engineering, Material science or any related semiconductor manufacturing discipline.
At least 10 years experience in Wafer Bumping Process Development.
Proficient in wafer bumping processes, including PVD, Lithography, Plating, Ball drop and WLCSP backend processes.
Strong analytical skills with hands-on experience in failure analysis and data analysis tools.
Proven leadership capability in driving new projects and technologies from planning and design through qualification and production ramp-up, in collaboration with cross functional teams.
Excellent communication skills with the ability to effectively engage both internal and external stakeholders.
Knowledge of Fan Out technology and assembly process is an added advantage.
