Senior Manager, Wafer Bumping R&D

Responsibilities:

. Technical project leader with cross functional team.

. Oversee new product development per required schedule and budget.

. Ensure smooth project execution till pre-production stage.

. Work closely and independently with internal/external customers and suppliers to evaluate new enabling process, materials and equipment through regular progress and status update.

. Enable technology offload to assembly and ensure system requirements and customers needs are met.

. Provide technical advice and consultation to secure business & strengthen competitiveness. Contribute actively to promoting the company's technological capability through customers presentation.

. Set, align and drive goals and strategies of department. Identify and propose new package and process development for the Company's roadmap.

. Manage resources efficiently to fulfil project/ program requirements as well as overall group performance and synergy. Provide coaching and non-technical assistance to remove barriers/ obstacles to achieve department goals.

Requirements:

. Minimum a Bachelor's degree in Electronics, Mechatronics, Engineering, Material science or any related semiconductor manufacturing discipline.

. At least 10 years experience in Wafer Bumping Process Development.

. Proficient in wafer bumping processes, including PVD, Lithography, Plating, Ball drop and WLCSP backend processes.

. Strong analytical skills with hands-on experience in failure analysis and data analysis tools.

. Proven leadership capability in driving new projects and technologies from planning and design through qualification and production ramp-up, in collaboration with cross functional teams.

. Excellent communication skills with the ability to effectively engage both internal and external stakeholders.

. Knowledge of Fan Out technology and assembly process is an added advantage.