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We are hiring Module Engineers (Process / Equipment) to support advanced semiconductor wafer fabrication in a high-volume manufacturing environment. This role focuses on Diffusion, Ion Implantation, Etch, or Thin Film deposition processes, ensuring stable tool performance, high yield, and continuous process improvement.
This is an excellent opportunity for engineers with semiconductor manufacturing, wafer fabrication, process engineering, or equipment engineering experience to grow in a leading global semiconductor company.
Key Responsibilities
Support daily semiconductor wafer fabrication operations within assigned module (Diffusion / Implant / Etch / Thin Film)
Perform process monitoring, equipment troubleshooting, and root cause analysis (RCA)
Drive yield improvement, defect reduction, and process optimization initiatives
Execute statistical process control (SPC), data analysis, and process capability monitoring
Support equipment qualification, preventive maintenance (PM), and tool recovery
Collaborate with Process Integration, Manufacturing, and Equipment Engineering teams
Participate in continuous improvement (CI), lean manufacturing, and cost reduction projects
Ensure compliance with safety, cleanroom protocol, and semiconductor quality standards
Requirements:
Degree / Diploma in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or related discipline
Experience in semiconductor manufacturing / wafer fabrication environment preferred
Exposure to Diffusion, Ion Implant, Etch, or Thin Film processes is highly advantageous
Knowledge of SPC, DOE, 8D, RCA, or yield management tools
Strong analytical, troubleshooting, and problem-solving skills
Familiar with cleanroom operations and high-volume manufacturing (HVM) environment
Good team player with strong communication skills
Willing to work in shift rotation (if required)
How to apply: Interested candidates, kindly email updated resume to [Confidential Information] with Subject of Engineer, thank you.
Job ID: 147648453
Skills:
8D reporting, Fmea, Spc, Troubleshooting, Doe, PMO methodologies, equipment development
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