Engineering Project Manager - APTD Operations

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Project/Program Management:

• Lead technology development programs and projects to deliver against defined go-to-market timelines.

• Align program- and project-level plans, dependencies, and deliverables to ensure timely, cohesive execution.

• Develop and maintain integrated project schedules in collaboration with cross-functional teams.

• Ensure all deliverables and artifacts meet program requirements and align with established business processes.

• Proactively identify and resolve risks, issues, and roadblocks, escalate as needed to protect timelines.

• Facilitate regular project reviews and meetings to track progress and address challenges.

• Monitor and communicate project status and overall program health to stakeholders.

• Centralize and manage project documentation and data using SharePoint and Confluence.

• Continuously improve technology development processes, tools, and systems to drive execution efficiency.

Operations Management

• Handle technology development and engineering builds in partnership with internal and external teams.

• Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.

• Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools.

• Optimize build schedules, material preparation, and logistics to align with business priorities and minimize waste and delays.

• Supervise daily execution, including wafer offloading, kitting, and support of PWF and assembly builds.

• Identify, mitigate, and escalate risks, issues, and interdependencies to protect timelines and outcomes.

• Coordinate engineering builds and APTD operations in compliance with established standards and processes.

• Lead cross-functional improvement initiatives and build strong stakeholder partnerships across programs.

Education and Experience

• Bachelor's or master's degree or equivalent experience in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering.

• 3-5+ years experience in Semiconductor Frontend/Backend Manufacturing, preferably minimum 1 year of HBM experience

• Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering.

• Solid understanding of advanced packaging flows

• Proficiency in essential computer applications, including Excel, Word, statistical tools, Confluence, Power BI, and Power Apps.

• Knowledge of SAP, Teamcenter and manufacturing execution systems.

• Knowledge of Project Management Tools/Systems.

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Demonstrated excellence in leading teams within a global manufacturing network composed of members from diverse fields and cultures.

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.