Engineering Director (Advanced Semiconductor Packaging)
Engineering Director (Advanced Semiconductor Packaging)
Achieve Group- Posted 4 hours ago
- Be among the first 10 applicants
Job Description
The role
- Reports to the BU General Manager
- Lead multi-discipline teams: process, mechanical, electrical and controls, software, optics and metrology, systems and lab
- Own system architecture and the placement and overlay error budget, from concept through to a qualified tool at customer sites
- Set the alignment strategy, including camera architecture, mark design rules, calibration and closed-loop overlay correction
- Run phase-gated development: design reviews, FMEA, requirements traceability, configuration control
- Manage engineering budget, schedule, technical risk and make-vs-buy decisions
- Work with Applications, Quality and Operations on tool qualification, SEMI S2/S8 compliance and transfer to manufacturing
- Set the roadmap toward finer pitch and tighter overlay, and build the BU's IP portfolio
- Hire and develop senior specialists in bond head, motion, optics, vision and equipment software
What you bring
- MS or PhD in mechanical, electrical, mechatronics or optical engineering, or physics
- 15+ years in semiconductor capital equipment, including 7+ years leading multi-discipline engineering teams
- Delivered at least one precision placement, bonding, lithography or metrology tool from concept to customer acceptance
- Deep expertise in sub-micron optical alignment and error budgeting
- Strong grounding in precision motion control, thermal and vibration management, and machine vision
- Working knowledge of die placement and bonding (hybrid bonding, TCB, flip-chip)
- Track record of hiring, developing and retaining senior technical talent
Good to have
- Direct experience with hybrid bonding, TCB or flip-chip bonders, or wafer-to-wafer aligners
- Patents or publications in alignment optics, precision motion or bonding
- Experience qualifying tools with foundries, IDMs or OSATs
How To Apply:
Interested candidate, please submit your updated resume in MS WORD Format to Terry Ng, email – [Confidential Information]
EA Personnel Reg. No. R1107654, Achieve Career Consultant Pte Ltd EA Licence No. 05C3451
We regret that only shortlisted candidates will be notified. Thank you for your interest in this opportunity.
More Info
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Key Skills
thermal and vibration management
sub-micron optical alignment
die placement
TCB
flip-chip
hybrid bonding
error budgeting
precision motion control
