Company
RF360 Singapore Pte., Ltd.
Job Area
Engineering Group, Engineering Group > Hardware Engineering
General Summary
Job Scope
- Responsible for end‑to‑end development, qualification, and mass‑production transfer of new processes, materials, and manufacturing technologies.
- Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and technology leadership.
- Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
- Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
- Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.
- Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment.
Job Responsibilities
Technology Development
- Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release.
- Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
- Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
- Translate product requirements into process specifications and control strategies. Technology Transfer & Ramp
- Co-own the technology transfer roadmap with project leader - from pilot line to high‑volume manufacturing. Adapts to shifting priorities and resources while ensuring deadlines are met.
- Supervise and provide technical guidance to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.
- Work with each process cluster to establish critical process windows, statistical control limits, and ramp‑readiness criteria.
- Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.
Education/ Experience Requirements
Bachelor's or Master's degree in Engineering (Materials, Chemical, Semiconductor, etc.).
- 3+ years of experience in process integration engineering, technology development, or a high volume manufacturing fab.
- Broad exposure to wafer-level packaging technology and processes.
- Demonstrated success leading cross disciplinary technology integration projects.
- Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.
- Excellent communication, technical documentation, and stakeholder management skills.
Skills, Abilities & Knowledge
Resourceful with critical thinking in problem solving.
- Project and priority management skills.
- Experience in semiconductor, MEMS, packaging, or high‑volume manufacturing.
- Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.
- Experience with scale-up from R&D → Pilot → HVM.
- Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).
- Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.
- Able attend training program overseas at sister's fab for up to 1 year.
Minimum Qualifications
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
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