ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Micron Technology's vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community.

We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing.

The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron's global network.

Main Responsibilities

• Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.

• Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.

• Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.

• Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).

• Perform risk assessments Failure Mode & Effect Analysis (FMEA) and implement effective control plans and corrective actions for abnormal conditions.

• Enable smooth technology transfer from development to highvolume manufacturing.

Minimum Required Qualifications

• Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.

• Operations support, including shift and weekend coverage, is required.

• Strong analytical, logical, and critical thinking skills

• Effective communicator, able to collaborate across all levels

• Growth mindset with a passion for continuous learning

• Internship or experience in the semiconductor industry is a plus

• Demonstrated leadership and a track record of impact are highly desirable

• Interest in and knowledge of the semiconductor industry and Micron is preferred

• Ability to apply baseline digital fluency and roleappropriate AI literacy to use AIenabled tools responsibly and effectively for research, analysis, content creation, problemsolving, operational tasks, and achieving business outcomes.

Embody Micron's core values:

• People - Respect, develop, and empower others

• Innovation - Drive continuous improvement and breakthrough thinking

• Tenacity - Show grit and determination

• Collaboration - Build trust and foster teamwork

• Customer Focus - Deliver excellence and value

MustHave Soft Skills

• Use AI -enabled tool responsibly and optimally for research, analysis, content creation, problem-solving, operational task, and achieving business outcome.

• Highly Desirable / Preferred Skills

• Familiarity with MES systems, automation, and data analytics tools (e.g., JMP, Python).

Inclusion & Accessibility Statement

• Micron is committed to fair, inclusive, and meritbased hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply.

  Performs hardware, software, semiconductor design or telecom engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.