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Engineer, Back-end Operation

Engineer, Back-end Operation

stmicroelectronics asia pacific pte ltd
5-7 Years
SGD 5,500 - 7,000 per month
  • Posted a month ago
  • Be among the first 10 applicants

Job Description

Job Summary

Drive & qualify new product introduction (NPI) with new back-end technology bricks for advanced Imaging Sensor package (Optical Module, Chip Scale Package) from early concept through high volume in collaboration with internal Process R&D, Manufacturing and Suppliers Management organization.

Coordinate & collaborate to solve complex technical bottlenecks in back-end technology process. Assess process changes & excursions supporting quality organization with internal and external customers.

It requires strong technical skills, solid stakeholder management and negotiation abilities, individual leadership and a multi-cultural approach. The role carries a high level of autonomy, accountability and decision-making skills together with the ability to lead complex international initiatives with a strong data driven mindset and influence stakeholders at multiple organizations levels.

Key focus includes technical gap assessment, Gross margin improvement & manufacturing performance to meet operations targets. On-time execution & technical issues solving to meet New Product Introduction milestones with full compliance on sustainability and quality requirement.

The Job requires flexibility to travel in South-East Asia (ST sites & Suppliers) & occasionally in Europe & USA.

Key responsibilities

  • Drive alignment among diverse stakeholders (Package R&D, QMT, Quality, Planning, BU) to achieve common business, technology, and operational goals
  • Coordinating Back-end process technology development & qualification from early concept to Mass Production ramp involving direct interactions with end customers.
  • Drive execution with multiple teams through structured coordination, tight follow-up to ensure program alignment and risk mitigation.

Requirements

  • Bachelor / Master's degree in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science
  • Experience in CMOS image sensors or advanced packaging technology
  • Experience in IC or electronics industrialization from early concept to volume production
  • Established experience of technical issues solved to meet critical milestones with strong knowledge on key data software analysis such as JMP and MATLAB
  • Able to work independently with minimal supervision and collaborate effectively in a multicultural team

More Info

Job Type:
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Key Skills

advanced packaging technology

electronics industrialization

CMOS image sensors

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