Electrochemical Plating Process Scientist (APM), IME

About the Role:

We are seeking a highly experienced and driven Electrochemical Plating Process Scientist to join our advanced packaging and semiconductor process development team. The ideal candidate will bring deep expertise in BEOL ECP processes, including Cu RDL, Cu pillar, TSV, and UBM plating, as well as strong capabilities in process control, equipment qualification, and yield improvement.

Key Responsibilities:

• Lead development and optimization of ECP processes for advanced packaging applications (e.g., Cu/Ni/Au plating, SnAg bump/solder plating).
• Drive process control and SPC for BEOL PVD and ECP processes, including Ti/Cu seed layers and barrier films.
• Manage equipment procurement, qualification, and supplier sourcing for plating chemicals and consumables.
• Support integration and yield improvement for SVP builds such as WLP, FOWLP, and C2W.
• Conduct DOE and troubleshooting for process enhancement and defect reduction.
• Collaborate cross-functionally with QA, integration, and equipment teams to ensure robust process performance.
• Champion continuous improvement initiatives including cost reduction, productivity enhancement, and system optimization.

Qualifications:

• PhD Degree in Physics, Materials Science, Chemistry or related field.
• Strong understanding of metal to metal bonding with minimum of 3 years of experience in ECP processes
• Strong analytical skills with tools like JMP, Excel, and defect analysis platforms.