Perform IC delayering using RIE, manual polisher and Plasma FIB
Perform nanoprobing analysis and its relevant functionality (EBAC/EBIC/EBIRCH)
Communicate with customer for selecting proper analytical technique and data interpretation
Prepare analytical reports
Document new failure analysis operating procedures, training and certification specs
Participate/assist in new failure analysis techniques development
Perform routine instrument preventive maintenance and laboratory housekeeping
Job Requirements:
At least Degree in Electrical / Electronic Engineering Material Science Engineering Science & Technology with a minimum of 3 years of relevant working experience.
Experience and familiar with advance technology node and FinFET/GAAFET is a must
Experience and familiar with nanoprobing is a must
Must be able to perform FA study individually and work well in teams
Maintain good 6S practice during daily operation
Experience in other FA techniques including: Sample preparation (parallel lapping, IC delayering, chemical decapsulation), X-Ray and FIB would be a bonus
Experience in Wafer Fab/Semiconductor/LED/Solar/HDD industries would be useful
A team player who can be independent, hardworking with a persevering attitude.
