Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

Job Description

As a Dry Etch MTS/Principal Engineer at Micron, you will join a highly skilled team dedicated to groundbreaking next-generation NAND technology. This role offers outstanding opportunities for innovation, collaboration, and the chance to work with innovative dry etch chambers. You will play a pivotal role in crafting flawless processes that meet and exceed program goals.

Responsibilities

Leading Dry Etch Unit Process and Critical Module Development:

• Develop and innovate dry etch processes to meet structural and electrical specifications.

• Collaborate and lead cross-functional teams to solve complex structural problems.

• Present process and technology roadmaps for current and upcoming technology nodes.

• Work on critical modules such as HAR, Tier by tier etches, WL contacts, and staircase.

Interaction with Other Process Areas:

• Find opportunities and drive towards collaborative solutions.

• Direct technology roadmaps for other areas.

• Lead or participate in cross-functional task force groups targeting specific goals.

• Develop knowledge and expertise in related process hardware or technologies.

Interaction with Dry Etch Peers:

• Act as a resource and mentor for peers in dry etch technology and project management

• Provide critical updates to upper management on project status and impacts

Requirements

Successful candidates for this position will have:

• Demonstrated interest in working within a research and development environment

• 3-10 years of experience in dry etch process development within R&D transferring to manufacturing

• 2-3 years of applicable NAND, DRAM, or Logic module development experience

• Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena

• Demonstrated leadership in problem-solving and managing technical projects

• Understanding of various types of plasma dry etch reactors

• Expertise in statistical process control and analysis

• Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches

• Ability to lead supplier head-to-heads

• Preferred experience in data science basics, Python coding, or AI coding

• Strong computer skills, including MS Office and SAS software like JmP

Education

• MS/PhD in Chemical, Mechanical, Electrical, Material Science, Physics, Molecular Physics, Physical Chemistry, Semiconductor Technology, or related fields with 4-10 years of practical experience in dry etch process development

• BS in Chemical, Mechanical, Electrical Engineering, Materials Engineering, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or similar fields with 7-12 years of pertinent experience