- Understand customer requirements and meet/exceed customer goals
- Drive team to set up stable manufacturing processes with CpK 1.67
- Drive engineering discipline (use DOEs and Statistical Process Engineering tools) in cost, yield and quality improvement
- Arrange training for Process Managers and Engineers.
- Deploy FDC and SPC on key equipment
- Partnership with cross functional teams to meet production schedules, quality and safety
- Customer engineering and issues resolution
- Plan and direct all aspects of engineering activities
- Drive team for continuous improvement in cost, yield and quality
- Responsible for setting up department KPIs
Required Experience and Qualifications:
- Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry or its equivalent with minimum of 15 years engineering experience in wafer fab or wafer bumping house, with at least 5 years management experience at Director/Deputy Director level in a fast moving environment
- Thorough knowledge of wafer level packaging, engineering and production
