We are seeking an experienced and dynamic Business Development Director to drive the growth and execution of the Design, Manufacture, & Packing (DMP) business across RF, Satcom, Defense, Radar, Microwave, High Power Devices, and System Integration solutions. The candidate will lead business development, technical engagement, product development strategy, and cross-functional execution from concept to mass production.
The ideal candidate should possess strong technical and commercial acumen, with hands-on experience in advanced electronic products and semiconductor-related system integration environments.
Key Responsibilities
- Lead and grow the DMP Business Unit in strategic technology markets including RF, Satcom, Defense, Radar, Microwave, and High Power applications.
- Drive business development activities, customer engagement, and strategic partnerships.
- Manage and support the full product lifecycle including:
- Proof of Concept (POC)
- Prototyping
- New Product Development (NPD)
- New Product Introduction (NPI)
- Mass Production (MP)
- Work closely with customers, suppliers, engineering teams, OSATs, and manufacturing partners to ensure successful project execution.
- Identify new market opportunities, technology trends, and business expansion strategies.
- Support system integration activities and technical solution development for complex customer requirements.
- Provide leadership in technical discussions, roadmap planning, risk management, and operational execution.
- Develop strong industry networks andmaintain close relationships with key stakeholders and ecosystem partners.
- Travel regionally and internationally to support customer engagement, business development, supplier management, and project execution.
Requirements
- Bachelor Degree in Engineering, Electronics, Semiconductor, Microwave/RF Engineering, or related field.
- Minimum10 years of relevant industry experience in RF, Satcom, Defense, Radar, Microwave, High Power Devices, or System Integration products.
- Strong technical background with understanding of semiconductor packaging, electronics manufacturing, and advanced system-level products.
- Proven experience managing products through the full lifecycle from POC to MP.
- Strong exposure to NPD/NPI environments and manufacturing transfer activities.
- Experience working with defense, aerospace, industrial, or high-reliability applications is highly preferred.
- Strongbusiness development mindset with established industry linkage and network.
- Excellent communication, leadership, negotiation, and stakeholder management skills.
- Ability to work independently in a fast-paced and cross-functional environment.
- Willingness to travel frequently for business engagements and customer support.
Preferred Qualifications
- Existing network and connections within RF, Satcom, Defense, Semiconductor, or Electronics ecosystem.
- Experience with high-reliability manufacturing and advanced packaging technologies.
- Knowledge in thermal management, high-frequency materials, microwave modules, or system-level integration is an added advantage.
- Familiarity with international customers, contract manufacturers, and supply chain ecosystem.
