As part of the CNC Machinist group, this position involves development of new manufacturing processes and lean manufacturing practices.
The role also involves Design tools and fixtures with Autocad and CNC Programming
To Operate of high Vacuum and Sinter HIP furnace, CNC, Dicing Saw and Precision Waterjet. Support the training of staff and line operators on manufacturing processes.
Inspection with wide variety of measuring devices, gages, optical equipment as well as develop quality procedures to ensure robust processes.
Perform preventive maintenance of machines and ensure Work Health and Safety in all processes
Roles & Responsibilities
Support processes to deposit conductive (metal) films by Plating, PVD Sputtering and Vacuum Evaporation.
Support film characterization techniques for metrology and inspection
Perform day-to-day operations of deposition tools - tool and process monitoring, post PM process qualification, troubleshooting
Work closely with integration and test teams on developing critical to quality (CTQ) metrics, root cause analysis (RCA) and corrective actions for yield improvements
Requirements
Min. Secondary/ITE-NTEC/Diploma/Degree level PE/ME/Mfg/Mechatronics or related displicine.
Min. 2 years of experience leading manufacturing processes in at least one of the following fields: semiconductor front or back end such as wafer bumping, dicing, mask design, plating and thin film process development.
Good analytical, verbal, written and interpersonal skills
Hands on fabrication: mechanical assembly, mechanical design and manufacturing and mask design.
Experience working around delicate high-tech equipment.
Experience in statistical analysis methods and tools, design of experiment
Understanding of materials characterization and FA techniques
