Job Responsibilities
Process Development & Optimization
- Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing.
- Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.
Equipment & Tooling Support
- Define equipment specifications and validate CMP tools.
- Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.
Yield & Quality Improvement
- Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
- Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.
Process Integration
- Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
- Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies.
Data Analysis & Documentation
- Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
- Document standard operating procedures (SOPs), work instructions, and control plans.
Cross-Functional Collaboration
- Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
- Assist with customer qualifications and reliability testing as needed.
Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Job Requirements
Professional Qualifications:
- PhD or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.
- 5-10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing.
- Hands-on experience with CMP tools.
- Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding.
Specialized Knowledge & Skills:
- Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
- Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
- Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes.
- Strong analytical, documentation, and problem-solving skills.
- Good communication and teamwork in a cross-functional environment.
