CMP Process Engineer (Manager / Senior Engineer)

Salary

8,000 SGD 14,000 SGD

Industry

Manufacturing(Electronics/Semiconductors)

Job Description

Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing.

Reports to: R&D Manager

Responsibilities

1) Process Development & Optimization
- Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric) in advanced substrate manufacturing.
- Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.

2) Equipment & Tooling Support
- Define equipment specifications and validate CMP tools.
- Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.

3) Yield & Quality Improvement
- Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
- Implement process monitoring techniques such as thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.

4) Process Integration
- Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
- Support the development of process flows for advanced packaging substrates, including SAP/Damascene and ABF/PI/PID-based technologies.

5) Data Analysis & Documentation
- Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
- Document standard operating procedures (SOPs), work instructions, and control plans.

6) Cross-Functional Collaboration
- Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
- Assist with customer qualifications and reliability testing as needed.

Requirement

Requirements & Preferences

(Must):
- PhD or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.
- 5-10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing.
- Hands-on experience with CMP tools.
- Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or embedding.
- Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
- Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
- Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes.
- Strong analytical, documentation, and problem-solving skills.
- Effective communication and teamwork in a cross-functional environment.

English Level

-

Other Language

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Benefit

What you will receive
- AWS
- Variable Bonus (based on company and individual performance)
- Annual Leave: 16 days (up to a maximum of 20 days)
- Medical Leave
- Family care leave (2 days/year)
- Dental care
- Company phone will be provided

Working Hour

8:00 17:00

Holiday

-

Job Function