Associate Engineer - Wafer Bumping Process Engineering
Job Description
- Line sustaining for wet processes (i.e. Metal Etch, Plating and PR Strip)
- Support lot dispositions and OCAP executions
- Involve in Continuous Improvement Projects
- Working with QM Dept. to response customer inquires and issues
- Execute CIP or project handling that contributes yield & cost efficiency improvement
- Ensure SPC is maintain and in control
- Support new material evaluation and new tool set up
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