Job Description
This role is fully hands-on and includes, but no limited to the following responsibilities:
- Lead the setup and buy-off of new processes and machines.
- Perform process setup, buy-off and execution of characterization activities, including DOE, prototype, qualification and mass production build.
- Trouble shoot and resolve machine-related issues to ensure smooth operations problem.
- Perform data collection, analysis and consolidation to support engineering activities.
Requirement
- Minimum Diploma in Material Science, Applied Physics, Mechanical Engineering or related discipline.
- Experience in high volume electronics manufacturing environment preferably semiconductor assembly.
- Must be familiar and have hands-on experience with either one of the following process and machines, (i) SMT/ Flux Clean, (ii) Flip Chip/ TCB, (iii) Underfill, (iv) Lid Attach/ Laser Mark, (v) Ball Mount/ AOI.
- Familiar with JMP data analysis capability.
- Knowledge and experience on multiple process of the above will be an advantage.
- Proven experience in assembly FOL/ EOL process (at least 3 years experience).
