Assoc Eng Equipment Engineering (Metrology)

Job Summary

The Associate Engineer - Backgrind & Dicing position supports critical wafer manufacturing processes by processing backgrind and dicing before final shipment. This role focuses on operating, monitoring, and improving backgrinding and dicing processes, including equipment setup, process control, and defect reduction. The Associate Engineer works closely with process/eqpt engineers, product/lot owner and cross-functional teams to troubleshoot issues, implement process improvements, and maintain compliance with safety and quality standards. This position is ideal for individuals with past hands on experiences in assembly/backgrind/dicing.

Your Job:

• Support daily run of backgrind and dicing

• Perform incoming and outgoing inspections

• Perform laminating, taping/detaping, backgrind and dicing as per process requirements

• Perform thickness measurement and enter data into SiView

• Carry out equipment PM according to plan PM schedule

• Key-in SPC data for all defined equipment critical parameters

• Performs other duties as assigned. (maybe assigned to support other line - diffusion/implant/wet)

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications:

• Diploma / ITE Hi-Nitec (Electrical/Electronic/Mechanical)

• Minimum 2years working experience in electronic production environment- preferably from OSAT/ assembly with experience in backgrind or dicing process

• Must be able to work on 12 hours rotating shift

• MS Office literate

• SPC knowledge