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Application Director (Advanced Semiconductor Packaging)

Application Director (Advanced Semiconductor Packaging)

Achieve Group
12-14 Years
Not Disclosed
  • Posted 4 hours ago
  • Be among the first 10 applicants

Job Description

The role

  • Reports to the BU General Manager
  • Lead applications, process integration, field service and on-site customer engineers
  • Turn customer process needs (die size, pad pitch, overlay, throughput, cleanliness) into tool specifications
  • Define test vehicles, alignment-mark requirements and acceptance criteria with customers and Engineering
  • Run customer demos and evaluations; diagnose overlay, die shift, void and bond-strength issues
  • Advise customers on mark design, layout and process changes that improve alignment and bond yield
  • Integrate the bonder with upstream and downstream steps: CMP, clean, plasma activation, anneal and metrology
  • Lead tool install and site acceptance; track uptime, MTBF and overlay stability, and feed field data back to Engineering and Quality
  • Build field service processes: install, escalation, spares and training
  • Support Sales with technical selling, benchmarks and roadmap input

What you bring

  • MS or PhD in materials science, chemical, electrical, mechanical or optical engineering, or physics
  • 12+ years in semiconductor equipment applications, process or field engineering, including 5+ years leading customer-facing teams
  • Hands-on advanced packaging experience: hybrid bonding, D2W or W2W, TCB or flip-chip
  • Process-level command of overlay data and alignment-mark performance
  • Led new-tool install and acceptance at a fab or OSAT
  • Strong in DOE, SPC, gauge R&R, and defect and yield analysis
  • Able to engage customer engineering leadership credibly

Good to have

  • Relationships with advanced packaging teams at foundries, IDMs or OSATs
  • Experience building a field service organisation from scratch
  • Familiarity with SEMI S2/S8 and fab facility requirements

How To Apply:

Interested candidate, please submit your updated resume in MS WORD Format to Terry Ng, email – [Confidential Information]

EA Personnel Reg. No. R1107654, Achieve Career Consultant Pte Ltd EA Licence No. 05C3451

We regret that only shortlisted candidates will be notified. Thank you for your interest in this opportunity.

Key Skills

yield analysis

alignment-mark performance

D2W

gauge R&R

overlay data

TCB

flip-chip

hybrid bonding

advanced packaging

W2W

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