Key Job Accountabilities:
- Operate MEOL/AOI process equipment such as dielectric deposition, etching, and metallization tools
- Operate plating systems for metal deposition including copper or solder plating
- Monitor equipment performance and process parameters during production
- Perform wafer handling and ensure proper lot movement through production stages
- Identify equipment abnormalities and escalate issues
- Support preventive maintenance and equipment checks
- Maintain operational logs and production documentation
Required Experience and Qualifications:
- Associate degree in Engineering or Semiconductor Technology preferred
- Basic knowledge of electroplating and solder reflow processes used in semiconductor packaging
- Experience operating plating equipment or thermal processing systems preferred
- Familiarity with plating chemistry control and process monitoring is a plus
- Understanding of wafer bumping or solder bump formation processes preferred
- Ability to follow chemical handling procedures and cleanroom safety protocols
- Strong troubleshooting and problem-solving skills in manufacturing environments
- Willingness to work rotating shifts in a semiconductor fabrication or packaging facility
