Advanced packaging Engineer (Principal/MTS)

We are seeking an experienced and highly motivated MTS/Principal Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands-on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes. This position offers a unique opportunity to work on cutting-edge packaging solutions that will drive the next generation of semiconductor devices.

Responsibilities

• Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.

• Technical Expertise: Provide guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.

• Project Management: Develop and maintain project plans, timelines, and budgets. Coordinate with cross-functional teams to ensure project milestones are met.

• Process Development: Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through-silicon vias (TSVs), die stacking, and thermal management.

• Quality Assurance: Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.

• Collaboration: Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production. Foster a collaborative and innovative environment.

• Documentation: Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.

• Problem Solving: Identify and resolve technical challenges related to 2.5D and 3D packaging integration. Implement corrective actions and continuous improvement initiatives.

• Training and Mentorship: Mentor junior engineers and technicians, providing guidance and support in their professional development.

• Compliance: Ensure all packaging processes comply with industry standards and regulatory requirements.

Qualifications

• Education: Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.

• 7 years of experience in semiconductor packaging, specifically in 2.5D and 3D heterogeneous integration technologies.

• Technical Skills: In-depth knowledge of 2.5D and 3D heterogeneous integration technologies, including interposer design, TSVs, die stacking, and system-in-package (SiP).

• Project Management: Proven track record of managing complex projects with cross-functional teams.

• Problem Solving: Strong analytical and problem-solving skills. Ability to troubleshoot and resolve technical issues efficiently.

• Communication: Excellent verbal and written communication skills. Ability to convey technical information clearly and concisely.

• Team Player: Demonstrated ability to work collaboratively in a team environment. Strong leadership and mentorship skills.