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Showing 3 jobs
Skills:
semiconductor packaging , Emerging Industry Trends, Manufacturing Process Knowledge, Product Commercialization, Structured Problem-Solving Methodologies, Process Qualifications, Risk Mitigation Strategies, Project Management, Advanced Manufacturing, Assembly
Skills:
C, C++, Python, protocol analyzers, logic analyzers, system board design debugging, PCIe validation, Oscilloscopes, cryptographic algorithms, high speed Serdes tuning, test automation scripts
Skills:
Design-for-Test (DFT), Automation Frameworks, Silicon Characterization, ATE platforms, Statistical analysis and problem-solving, Production Release, Advanced data analytics, SoC Test Development, Yield analysis and optimization, Yield Improvement, SoC architectures, Wafer sort and final test methodologies, Product Qualification, AI-assisted engineering tools, Test development and qualification
