Statistical Process Control (SPC), Design of Experiment (DOE), hardware installations, Process Evaluation, customer wafer fabrication processing flow

Scripting, Vba, Agile, AOI, Power Bi, Microsoft Office, Plating, Fmea, S-parameters, Data analysis software, Exensio, sputtering, Harmonics generation, 7 Qc Tools, Programming macro, photolithography, NPI Process Integration, Hot S-parameters, Thermal measurement, IMD, Bonding, Backgrinding, Load pull, Noise emissions, Statistical Process Control, Jmp, Product Engineer, RF Characterization, Dicing, ONTO

Through-Silicon Via (TSV) technologies, six sigma processes, Die Reconstitution, Statistical Tools, Plasma UV Cleaning, Lean Manufacturing, Bond Debond, process SPC, advanced packaging processes, DOE techniques